COB / LED / SMART CARD MODULES ASSEMBLY
COB & LED Production Capacity – 34 millions wires
SMART CARD MODULES – 1.5 Millions
Process Quality Control
- Incoming Material
- Qty, Inspection Part no. - Die Attach
- Die Shear Test, Epoxy Coverage, QC Sampling AQL105G Normal II. - Oven Curing - Temperature.
- WB - Bonding Accuracy, Wire Pull Test.
- Encap - Bubbles, Height.
- Final - Functional Test.
- QA Buyoff
- Packing
Facility Equipments
Die Attach
[ASM AD809 – 4 Units]Aluminium Wire Bonding
[DIAS US2900 – 8 Units]Aluminium Wire Bonding
[ASM AB509 - 2 Units] [ASM AB559 - 1 Unit]
Gold Wire Bonding
[ASM AB309 – 5 Units]Potting Machine
[DIAS AB600 - 1 Unit] [Camalot with UV Curing System - 3 Units]
Functional Tester
[Computer Eye Start tester][Manual COB tester]
Functional Tester
[Smart Card ATR tester][OS Loading Tester]
Curing Oven
[Blue M Oven – 12 Units]Curing Oven
[UV Conveyer Curing Oven – 1 Unit]10K Clean Room
[Clean Room][Air Shower]
Chemical Lab
[Chemical Lab][Fume Hood Scrubber]